<New Graduate Hiring> Wire Bond Process Engineer

• Monitor and optimize Wire Bond manufacturing processes to achieve targets in Quality, Yield, Productivity, and Cost.
• Investigate manufacturing issues, customer complaints, and quality excursions by performing root cause analysis and implementing corrective/preventive actions.
• Drive continuous improvement projects to enhance process robustness, equipment utilization, OEE, yield performance, and operational efficiency.
• Establish and maintain process control systems, including SPC, OCAP, FMEA, control plans, and engineering specifications.
• Collaborate with cross-functional teams including Production, Equipment Engineering, Quality, Industrial Engineering, Planning, and R&D to resolve manufacturing challenges and improve factory performance.
• Analyze manufacturing data and develop data-driven solutions for process optimization and defect reduction.
• Conduct regular Gemba activities, risk assessments, and process audits to ensure manufacturing compliance and operational excellence.
• Support customer audits, internal audits, and quality management system requirements.
• Drive factory KPIs improvement, including Yield, Quality, Capacity, OEE, Cycle Time, and Cost Reduction targets.

Requirements:

• Bachelor’s degree or above in Engineering or a related field.

• TOEIC 600+ or equivalent English proficiency.

• Within 2 years of working experience. Semiconductor industry experience is preferred.

• Good communication and teamwork skills.

• Leadership experience or potential is a plus.

• Proactive, responsible, and willing to learn in a dynamic environment.

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